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(footprint "SolderJumper-2_Dense" (version 20221018) (generator pcbnew)
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(layer "F.Cu")
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(attr smd)
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(fp_text reference "REF**" (at 0 -1 unlocked) (layer "F.SilkS")
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(effects (font (size 1 1) (thickness 0.15)))
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(tstamp 4e80691e-75c0-4161-8fe8-1eb508ab4b1a)
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)
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(fp_text value "SolderJumper-2_Dense" (at 0 0.85 unlocked) (layer "F.Fab")
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(effects (font (size 1 1) (thickness 0.15)))
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(tstamp d0a68fec-6b3c-43b9-8aea-4b45f722f6a8)
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)
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(fp_rect (start -0.55 -0.35) (end 0.55 0.35)
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(stroke (width 0.05) (type default)) (fill none) (layer "F.CrtYd") (tstamp 50302a85-421c-4726-8f6c-74fdf7242944))
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(pad "1" smd roundrect (at -0.3 0) (size 0.4 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
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(chamfer_ratio 0) (chamfer top_right bottom_right)
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(thermal_bridge_angle 45) (tstamp ab8e9386-fe7e-4c75-ba70-c12374706059))
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(pad "2" smd roundrect (at 0.3 0) (size 0.4 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
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(chamfer_ratio 0) (chamfer top_left bottom_left)
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(thermal_bridge_angle 45) (tstamp 5b50a2bd-fcae-490e-b0e3-6c96f9c873e7))
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)
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