(footprint "SolderJumper-2_Dense" (version 20221018) (generator pcbnew)
  (layer "F.Cu")
  (attr smd)
  (fp_text reference "REF**" (at 0 -1 unlocked) (layer "F.SilkS")
      (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 4e80691e-75c0-4161-8fe8-1eb508ab4b1a)
  )
  (fp_text value "SolderJumper-2_Dense" (at 0 0.85 unlocked) (layer "F.Fab")
      (effects (font (size 1 1) (thickness 0.15)))
    (tstamp d0a68fec-6b3c-43b9-8aea-4b45f722f6a8)
  )
  (fp_rect (start -0.55 -0.35) (end 0.55 0.35)
    (stroke (width 0.05) (type default)) (fill none) (layer "F.CrtYd") (tstamp 50302a85-421c-4726-8f6c-74fdf7242944))
  (pad "1" smd roundrect (at -0.3 0) (size 0.4 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
    (chamfer_ratio 0) (chamfer top_right bottom_right)
    (thermal_bridge_angle 45) (tstamp ab8e9386-fe7e-4c75-ba70-c12374706059))
  (pad "2" smd roundrect (at 0.3 0) (size 0.4 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
    (chamfer_ratio 0) (chamfer top_left bottom_left)
    (thermal_bridge_angle 45) (tstamp 5b50a2bd-fcae-490e-b0e3-6c96f9c873e7))
)