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132 lines
2.8 KiB
132 lines
2.8 KiB
{ |
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"Header": { |
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"GenerationSoftware": { |
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"Vendor": "KiCad", |
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"Application": "Pcbnew", |
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"Version": "7.0.1-3b83917a11~172~ubuntu22.04.1" |
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}, |
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"CreationDate": "2023-04-10T17:36:39+00:00" |
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}, |
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"GeneralSpecs": { |
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"ProjectId": { |
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"Name": "ducklace", |
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"GUID": "6475636b-6c61-4636-952e-6b696361645f", |
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"Revision": "rev?" |
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}, |
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"Size": { |
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"X": 18.1, |
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"Y": 47.75 |
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}, |
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"LayerNumber": 2, |
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"BoardThickness": 2.0, |
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"Finish": "Immersion gold" |
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}, |
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"DesignRules": [ |
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{ |
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"Layers": "Outer", |
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"PadToPad": 0.2, |
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"PadToTrack": 0.2, |
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"TrackToTrack": 0.2, |
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"MinLineWidth": 0.2, |
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"TrackToRegion": 0.5, |
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"RegionToRegion": 0.5 |
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} |
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], |
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"FilesAttributes": [ |
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{ |
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"Path": "ducklace-CuTop.gtl", |
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"FileFunction": "Copper,L1,Top", |
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"FilePolarity": "Positive" |
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}, |
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{ |
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"Path": "ducklace-CuBottom.gbl", |
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"FileFunction": "Copper,L2,Bot", |
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"FilePolarity": "Positive" |
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}, |
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{ |
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"Path": "ducklace-PasteBottom.gbp", |
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"FileFunction": "SolderPaste,Bot", |
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"FilePolarity": "Positive" |
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}, |
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{ |
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"Path": "ducklace-PasteTop.gtp", |
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"FileFunction": "SolderPaste,Top", |
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"FilePolarity": "Positive" |
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}, |
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{ |
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"Path": "ducklace-SilkTop.gto", |
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"FileFunction": "Legend,Top", |
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"FilePolarity": "Positive" |
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}, |
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{ |
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"Path": "ducklace-SilkBottom.gbo", |
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"FileFunction": "Legend,Bot", |
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"FilePolarity": "Positive" |
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}, |
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{ |
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"Path": "ducklace-MaskBottom.gbs", |
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"FileFunction": "SolderMask,Bot", |
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"FilePolarity": "Negative" |
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}, |
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{ |
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"Path": "ducklace-MaskTop.gts", |
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"FileFunction": "SolderMask,Top", |
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"FilePolarity": "Negative" |
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}, |
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{ |
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"Path": "ducklace-EdgeCuts.gm1", |
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"FileFunction": "Profile", |
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"FilePolarity": "Positive" |
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}, |
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{ |
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"Path": "ducklace-CmtUser.gbr", |
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"FileFunction": "Other,User", |
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"FilePolarity": "Positive" |
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} |
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], |
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"MaterialStackup": [ |
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{ |
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"Type": "Legend", |
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"Name": "Top Silk Screen" |
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}, |
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{ |
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"Type": "SolderPaste", |
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"Name": "Top Solder Paste" |
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}, |
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{ |
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"Type": "SolderMask", |
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"Thickness": 0.01, |
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"Name": "Top Solder Mask" |
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}, |
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{ |
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"Type": "Copper", |
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"Thickness": 0.035, |
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"Name": "F.Cu" |
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}, |
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{ |
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"Type": "Dielectric", |
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"Thickness": 1.91, |
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"Material": "FR4", |
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"Name": "F.Cu/B.Cu", |
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"Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)" |
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}, |
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{ |
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"Type": "Copper", |
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"Thickness": 0.035, |
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"Name": "B.Cu" |
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}, |
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{ |
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"Type": "SolderMask", |
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"Thickness": 0.01, |
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"Name": "Bottom Solder Mask" |
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}, |
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{ |
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"Type": "SolderPaste", |
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"Name": "Bottom Solder Paste" |
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}, |
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{ |
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"Type": "Legend", |
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"Name": "Bottom Silk Screen" |
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} |
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] |
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}
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