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20 lines
1.1 KiB
20 lines
1.1 KiB
(footprint "SolderJumper-2_Dense" (version 20221018) (generator pcbnew) |
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(layer "F.Cu") |
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(attr smd) |
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(fp_text reference "REF**" (at 0 -1.5 unlocked) (layer "F.SilkS") |
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(effects (font (size 1 1) (thickness 0.15))) |
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(tstamp 4e80691e-75c0-4161-8fe8-1eb508ab4b1a) |
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) |
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(fp_text value "SolderJumper-2_Dense" (at 0 1.5 unlocked) (layer "F.Fab") |
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(effects (font (size 1 1) (thickness 0.15))) |
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(tstamp d0a68fec-6b3c-43b9-8aea-4b45f722f6a8) |
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) |
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(fp_rect (start -1.2 -0.85) (end 1.2 0.85) |
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(stroke (width 0.05) (type default)) (fill none) (layer "F.CrtYd") (tstamp 50302a85-421c-4726-8f6c-74fdf7242944)) |
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(pad "1" smd roundrect (at -0.6 0) (size 1 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0) |
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(chamfer_ratio 0.25) (chamfer top_left bottom_left) |
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(thermal_bridge_angle 45) (tstamp ab8e9386-fe7e-4c75-ba70-c12374706059)) |
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(pad "2" smd roundrect (at 0.6 0) (size 1 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0) |
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(chamfer_ratio 0.25) (chamfer top_right bottom_right) |
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(thermal_bridge_angle 45) (tstamp 5b50a2bd-fcae-490e-b0e3-6c96f9c873e7)) |
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)
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