more compact

flexifly.kicad_prl

@@ -1,6 +1,6 @@
 {
   "board": {
-    "active_layer": 31,
+    "active_layer": 0,
     "active_layer_preset": "",
     "auto_track_width": true,
     "hidden_netclasses": [],

flexifly.kicad_pro

@@ -53,6 +53,11 @@
           "gap": 0.0,
           "via_gap": 0.0,
           "width": 0.0
+        },
+        {
+          "gap": 0.15,
+          "via_gap": 0.4,
+          "width": 0.15
         }
       ],
       "drc_exclusions": [],
@@ -118,11 +123,11 @@
         "min_hole_to_hole": 0.25,
         "min_microvia_diameter": 0.19999999999999998,
         "min_microvia_drill": 0.09999999999999999,
-        "min_resolved_spokes": 2,
+        "min_resolved_spokes": 1,
         "min_silk_clearance": 0.0,
         "min_text_height": 0.7,
         "min_text_thickness": 0.09999999999999999,
-        "min_through_hole_diameter": 0.3,
+        "min_through_hole_diameter": 0.19999999999999998,
         "min_track_width": 0.15,
         "min_via_annular_width": 0.13,
         "min_via_diameter": 0.3,
@@ -187,6 +192,10 @@
           "diameter": 0.0,
           "drill": 0.0
         },
+        {
+          "diameter": 0.4,
+          "drill": 0.2
+        },
         {
           "diameter": 0.56,
           "drill": 0.3

flexifly.pretty/SolderJumper-2_Dense.kicad_mod

@@ -0,0 +1,20 @@
+(footprint "SolderJumper-2_Dense" (version 20221018) (generator pcbnew)
+  (layer "F.Cu")
+  (attr smd)
+  (fp_text reference "REF**" (at 0 -1.5 unlocked) (layer "F.SilkS")
+      (effects (font (size 1 1) (thickness 0.15)))
+    (tstamp 4e80691e-75c0-4161-8fe8-1eb508ab4b1a)
+  )
+  (fp_text value "SolderJumper-2_Dense" (at 0 1.5 unlocked) (layer "F.Fab")
+      (effects (font (size 1 1) (thickness 0.15)))
+    (tstamp d0a68fec-6b3c-43b9-8aea-4b45f722f6a8)
+  )
+  (fp_rect (start -1.2 -0.85) (end 1.2 0.85)
+    (stroke (width 0.05) (type default)) (fill none) (layer "F.CrtYd") (tstamp 50302a85-421c-4726-8f6c-74fdf7242944))
+  (pad "1" smd roundrect (at -0.6 0) (size 1 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0)
+    (chamfer_ratio 0.25) (chamfer top_left bottom_left)
+    (thermal_bridge_angle 45) (tstamp ab8e9386-fe7e-4c75-ba70-c12374706059))
+  (pad "2" smd roundrect (at 0.6 0) (size 1 1.5) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0)
+    (chamfer_ratio 0.25) (chamfer top_right bottom_right)
+    (thermal_bridge_angle 45) (tstamp 5b50a2bd-fcae-490e-b0e3-6c96f9c873e7))
+)